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TempKoat® N Negative Temporary Photoresist

15 µm trenches in 15 µm thick TempKoat® N before and after copper plating and resist removal

TempKoat® N is a chemically amplified, negative-tone resist series for advanced packaging and MEMS applications.

TempKoat® N 15 is the first dilution available in the TempKoat® N series and is optimized for thick resist applications from 7 to 20 μm.