PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach. This includes very high resolution metallization (<0.25μm), as well as very thick (> 3μm) metallization. These unique materials are available in a variety of formularies to meet virtually any customer need.