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title: KMSF® 2000 TDS Download Landing Page
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Download Technical Data Sheet

### KMSF® 2000 Low Dk/Df Photo-dielectric

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KMSF® 2000 is a negative-tone, low-temperature cure, **PPE-copolymer-based photo-dielectric** for high reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low temperature cure, and robust balance of mechanical and electrical properties.

KMSF® 2000 provides excellent performance with a low dielectric constant **(Dk = 2.5)** and a low dissipation factor **(Df = 0.003)**, making it ideal for applications that require high-frequency reliability and signal integrity. It is engineered for an optimal cured film thickness of 5 to 10 μm, providing versatility and consistency in high-performance electronic packaging solutions.

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