KMSF® 2000 Low Dk/Df Photo-dielectric

KMSF® 2000 is a negative-tone, low-temperature cure, PPE-copolymer-based photo-dielectric for high reliability heterogeneous design in advanced packaging. It provides a unique advantage offering through its improved pattern resolution, low temperature cure, and robust balance of mechanical and electrical properties.

KMSF® 2000 provides excellent performance with a low dielectric constant (Dk = 2.5) and a low dissipation factor (Df = 0.003), making it ideal for applications that require high-frequency reliability and signal integrity. It is engineered for an optimal cured film thickness of 5 to 10 μm, providing versatility and consistency in high-performance electronic packaging solutions.