KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low stress buffer, passivation or protective layer. This innovative material provides exceptional warpage control, making it ideal for thin and large diameter substrates used in backend assembly processing. Its low shrinkage, very low tensile modulus, and minimal thermal cure requirements ensure reliable performance. Film thicknesses of ~ 3 to 10 µm can be achieved in a single coat.
